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发布时间:2026-08-26

旋转的爱

US judge’s halt to Pentagon's 'military company' label on WuXi AppTec proves arbitrary blacklists 'not beyond challenge': experts_我的网站

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一 |       当地时间8月23日,半导体行业研究机构SemiAnalysis发文称,NAND闪存制造正从钨转向钼,因为当NAND来到300层以上,钼是必选项。    

A photo shows WuXi AppTec in the Waigaoqiao Bonded Area of the Shanghai Free Trade Zone. Photo: VCG
    A photo shows WuXi AppTec in the Waigaoqiao Bonded Area of the Shanghai Free Trade Zone. Photo: VCG
A US federal judge on Friday temporarily "barred the Pentagon from including Chinese biotechnology group WuXi AppTec on a list of companies believed to support Beijing's military," according to Reuters. Chinese experts said the ruling sends a positive signal for Chinese companies operating in the US, showing that Washington's arbitrary, fact-deficient national security blacklists are not beyond challenge and that firms should make greater use of legal means to defend their legitimate rights.
US District Judge James Boasberg issued an order blocking enforcement of the designation of WuXi in June after the company filed suit. WuXi in a statement welcomed the court's ruling, saying it "relieves us from the immediate adverse consequences" of the Defense Department's designation during the litigation. "We believe that the facts, as demonstrated in our court filings, will prevail after an objective and fair judicial review," a WuXi spokesperson said, according to the report. 
A South China Morning Post report noted that the ruling represents an early legal victory for one of China's largest pharmaceutical research and manufacturing service providers and a setback for Washington's expanding use of national-security restrictions against major Chinese commercial companies.
Gao Lingyun, a research fellow at the Chinese Academy of Social Sciences, told the Global Times that the Pentagon's controversial "list-first, evidence-later" approach has bred massive operational uncertainty for Chinese enterprises conducting legitimate business in the US. By arbitrarily imposing restrictive labels before presenting credible proof, Washington creates an opaque and unpredictable regulatory environment that disrupts normal commercial expectations. 
The US Department of Defense released its updated Section 1260H list on June 8, marking the first time WuXi AppTec was formally included, alongside Alibaba, Baidu, BYD and Unitree Robotics, among others. 
On June 12, WuXi AppTec announced it had filed suit against the Department of Defense in the US District Court for the District of Columbia. The company said the department's decision was erroneous and lacked factual basis or support under applicable statutes and case law.
He Weiwen, a senior fellow at the Center for China and Globalization, noted that when Chinese companies face unfair and unjustified suppression in the US, they cannot rely solely on corporate statements or diplomatic representations; they must also protect themselves through legal means. Filing suit in federal court is entirely necessary and correct, he said.
"In the past, quite a few Chinese companies had nothing to do with so-called military matters but were hit with US countervailing and anti-dumping measures. Many won their cases after appealing to the Court of International Trade. Legal recourse is an indispensable tool and one we need to take more seriously," he said.
In January 2021, Xiaomi was placed on a similar Pentagon list. The Chinese company later announced on May 26, 2021 that a US court has removed the company's designation as a military-related company and lifted all restrictions on US persons buying or holding its stock, Reuters reported. 
The designation has so far had little impact on WuXi AppTec's business. The company reported on August 3 that first-half revenue rose 38.9 percent year-on-year to 28.9 billion yuan, while net profit attributable to shareholders climbed 29.4 percent to 11.08 billion yuan — its first half-year profit above the 10-billion-yuan mark, said media reports.
When asked about US placing several Chinese technology companies including Alibaba, Tencent, BYD, on a list of firms that it says aid China's military, Chinese Foreign Ministry spokesperson Lin Jian said that China firmly opposes the US overstretching the concept of national security and formulating various types of discriminatory lists to go after Chinese businesses. "We urge the US to correct its wrongdoings, and stop the unwarranted suppression of Chinese businesses. China will do what is necessary to firmly protect their legitimate and lawful rights and interests," said Lin. 
image  SemiAnalysis分析,3D NAND闪存堆叠层数突破300层后,钨字线在电阻、化学兼容性和深孔填充三方面均触及物理极限,钼成为强制替代材料。三星已于2024年量产,美光2025年跟进,SK海力士计划2026年底推出375层钼工艺产品。其估计,钼在NAND总产能中的占比将从2025年的中个位数百分比,增长至2027年的约30%。

二 |   更进一步的,该机构提出,钼沉积设备将在明年迎来超10亿美元的新增市场。image  该机构称,每一次从钨到钼的转换,都意味着需要新的沉积设备。SemiAnalysis估计,仅2027年一年,NAND钼沉积设备的销售额就将超过10亿美元,并随着DRAM和逻辑芯片的跟进,到2030年增长至约20亿美元/年。  受益格局方面,Lam Research(泛林集团)最先获益,TEL(东京电子)紧随其后;AMAT(应用材料)、ASMI(ASM国际)及Naura(北方华创)则更多受益于后续DRAM和逻辑芯片的转型浪潮。SemiAnalysis表示,完整的细分市场层面测算已纳入其前道设备(WFE)模型。

三 |   钼渗透率在高层数NAND中提升,本质是为延续NAND单位Bit成本下降曲线。  300层NAND主要在结构上升级,聚焦超高深宽比通道孔刻蚀、多次Stack堆叠、晶圆翘曲控制以及Overlay精度控制。  375层乃至400层以后,材料亟需升级,因钨字线会因为字线间距通道孔缩小面临RC延迟快速恶化、WF残氟导致介质损伤、漏电失效率提升以及填充缺陷放大的问题。而钼凭借更低电阻率、无氟前驱体及无需阻隔层等优势,有望改善RC性能与器件可靠性,为字线和存储孔缩放提供工艺余量,从而延续高层数NAND的成本下降曲线。

四 |   中银证券表示,SK海力士已完成375层3D NAND生产验证并计划2026年底量产,拟采用钼材料替代钨制作字线,继三星在286层第九代3D NAND中率先导入钼工艺后,两大存储龙头相继切换,钼替代钨趋势确立。  然而,钼的材料加工更为复杂,因为必须以气体形式输送,且前驱物在室温下为固体,需要加热器以确保流动稳定性。  基于此,300层以上3D NAND字线由钨切换为钼,并不是简单更换靶材或者更换气体材料,而是前驱体供给、ALD沉积腔体、刻蚀、清洗、尾气处理整套工艺链条的重构,原有钨CVD产线硬件无法直接复用,将直接推动晶圆厂资本开支上行,同时设备、特种材料、零部件均迎来变化。  爱建证券表示,钼导入本质是一次全流程工艺重构,设备链受益有望沿“沉积及前驱体输送→CMP及清洗→刻蚀→量检测”路径传导,工艺难点由沉积向后处理环节延伸。其中——  沉积:成熟的WF钨工艺,Mo沉积需重新建立高深宽比结构下的填充与缺陷控制工艺窗口,同时有望减少阻隔层使用,带动沉积设备及配套工艺升级;  输送:Mo前驱体通常采用低挥发性固态源,与传统WF气态前驱体体系差异较大,需要新增气化装置、温控管路及精密供气系统,以保障前驱体稳定输送;  CMP:Mo材料的氧化及表面化学特性不同于传统金属体系,需重新开发CMP研磨液和研磨垫,以满足平坦化、去除速率及缺陷控制要求;  清洗:Mo导入后残留物及氧化物体系发生变化,高深宽比结构下金属残留和污染控制难度提升,有望推动相关湿法清洗设备及配套化学品验证导入;  刻蚀环节则需重新建立适配钼材料的工艺窗口,且3DNAND层数持续提升下,刻蚀选择性、侧壁形貌控制及层间均匀性要求进一步提高,有望带动相关刻蚀设备升级需求;  量检测:Mo量产还需新增膜厚均匀性、填充缺陷、金属残留及电学可靠性等监控项目,有望带动薄膜量测、缺陷检测及电性测试等设备需求增长。

五 |   该机构称,NAND工艺迭代核心从单纯堆叠层数转向材料—设备—工艺协同创新,新材料导入将持续催生沉积、刻蚀、清洗等关键设备迭代升级,Mo字线导入将推动沉积、刻蚀、清洗等关键环节工艺升级,相关设备及零部件厂商有望受益。(文章来源:科创板日报)。

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